Electrical & Electronics

By making full use of all our technical expertise in electrochemistry, organic synthesis and polymer synthesis, we develop new, high-quality products from a variety of materials and parts that contribute to advances in the progress of electronic devices. In particular, we are putting its efforts into display devices for smartphones and electronic paper, as well as functional materials and parts for semiconductors.

R&D Topics	Low chlorine content resins for IC sealant, Printed circuit formation technologies for the next generation, Ultrafine particle conducting materials

Plating Process Using Insoluble Electrodes

With regard to our electrode technology, the Roll to Roll plating process has been completed using insoluble electrodes. Compared with existing process, this approach makes it easier to improve efficiency and makes mass production simpler with regard to higher electro-density plating. As a result, this approach is used in a variety of fields as a base technology for the formation of plastic film circuits.
Currently, we are developing application technologies for plating plastic film, a material that is said to be difficult to plate.

An example of the dual-layer CCL (metalizing method) manufacturing process

Plastic Film Circuit Formation Technology

By combining a variety of technologies such as etching, printing, etc., we have developed several technologies for the formation of circuits on plastic film.
For example, through the adoption of the thinner circuitry on the touchscreen panel frame, these technologies have contributed to as the development of lighter smartphones with larger display panels.

Copper circuit for use in a touchscreen panel

Low-chlorine High Purity Epoxy Resin

Our line up of low-chlorine high purity epoxy resins are capable of responding to the needs of electronic devices for increased complexity and ever-reducing size, as a raw material for sealing agents for semiconductors, under-fill, die bond paste, and as a conductive adhesive, etc. In line with advances in micro-fabrication technology for semiconductors, we have developed Bis-Phenol F type as a lower viscosity grade low-chlorine high purity epoxy resin.

Bis-Phenol F type low-chlorine high purity epoxy resin
(hydrolyzable chlorine: less than 10ppm; total chlorine: less than 150ppm)